through silicon via (TSV)

Multiobjective Deep Reinforcement Learning Driven Collaborative Optimization of TSV-Based Microchannel and PDN for 3-D ICs
This study introduces a multiobjective deep reinforcement learning (MODRL) framework for the concurrent thermal-hydraulic optimization of the through-silicon-via (TSV) microchannel heat sink (MCHS) embedded in 3-D integrated circuits (3-D ICs) power delivery network (PDN).
DOI
Smart cooling: Hydrogel-enhanced adaptive jet impingement utilizing through silicon via for integrated microsystems
DOI